Ceramic Circuit Board Material

Supply high thermal conductivity low expansion ceramic pcb.

Ceramic circuit board material.

Pcb materials can be classified according to their properties. You can use them for high power circuits chip on board modules proximity sensors and more. The multilayer ceramic pcb is extremely versatile and can replace a complete traditional printed circuit board with a less complex design and increased performance. Ceramic circuit boards are actually made of electronic ceramics material and can be made into various shapes.

Better cte matching and hermetic sealing only add to the appeal of these materials. One of the main reasons why you would avoid fr4 vs. A printed circuit board pcb is a board made of different heat resistant insulating materials conductive copper tracks are printed or etched onto this con conductive base substrate. Ceramic substrates such as alumina aluminum nitride and beryllium oxide are highly thermally conductive materials which transfer heat away from hot spots quickly and efficiently dissipating it over the whole surface.

Ceramic circuit boards designed for high temperatures are often referred to as high temperature co fired ceramic htcc circuits. Fr4 pcb material is not. A comprehensive introduction of ceramic pcb as chip components and smt surface mount technology are massively accepted by electronics industry traditional pcbs printed circuit boards with organic laminates as substrate material are developing towards high precision high density and high reliability. The base material of a pcb ccl copper.

More for dcb ceramic pcb application of ceramic pcb. High ceramic pcb thermal conductivity is probably the leading reason more industries are turning to ceramics in their printed circuit boards and packages as this material has a clear edge over plastics in this regard. Ceramic pcbs like aluminum nitride aln and aluminum oxide al203 are extremely thermally conductive. A ceramic circuit board or other mcpcb board has to do with heat transfer.

C dcb ceramic board dcb direct copper bonded technology denotes a special process in which the copper foil and the core al2o3 or aln on one or both sides are directly bonded under appropriate high temperature and pressure.