Ceramic Dip Package

7 62 mm or 0 6 inch 15 24 mm.

Ceramic dip package.

Standard packages and lids for device evaluation. Spst x 4 two complementary pairs per package. Another example of a ceramic. Like dip but with staggered zig zag pins.

Cpgas are typically a square ceramic multilayer package with an array of pins brazed onto either the front side of the package cavity down or on the backside of the package cavity up. Package outline material information. Ceramic packages for large scale integration lsi devices. Non standard dip with smaller 0 07 in 1 78 mm pin spacing.

And having a row spacing associated with body width varies depending on lead counts with 0 3 in. Both passive or active devices may be found using ceramic packages. Spst x 4 two complementary pairs per package. Material properties process flow.

Standard dip with 0 1 in 2 54 mm pin spacing rows 0 3 in 7 62 mm apart. Kyocera will present its ceramic packages at cioe 2018 china s most popular optoelectronics exhibition. The most commonly found ceramic dip packages have an inter lead spacing or lead pitch of 0 1 inch 2 54 mm. Cerdip ceramic q ceramic dual inline package glass seal package drawing q filter packages by entering lead count or product description into the search box below.

Medical and healthcare. Kyocera offers a wide variety of standard ceramic packages including ceramic dual inline packages c dip ceramic small outline packages c sop ceramic pin grid array packages c pga ceramic quad flat packages c qfp ceramic quad flat j leaded packages c qfj and ceramic quad flat non leaded packages c qfn. Minimum pin count is 28 while the maximum pin count is limited to the manufacturer s capabilities. 14 lead cerdip q 14 pdf.

Ceramic substrates for probe cards.